Dishing Improve in Advanced Technology Nodes
Author:
Affiliation:
1. Advanced Module Technology Development, Shanghai Huali Integrated Circuit Corporation,Shanghai,China,201314
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856713.pdf?arnumber=9856713
Reference5 articles.
1. Poly CMP Process Challenges for Embedded Array Devices
2. Reduction of Dishing in Polysilicon CMP for MEMS Application by Using protective Layer and High Selectivity;shin;International Conference on Planarization/CMP Technology,2007
3. Electrical characterization of the copper cmp process and derivation of metal layout rules
4. Dishing and erosion in STI CMP
5. Dishing-Radius Model of Copper CMP Dishing Effects
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