Author:
Chandrasekhar Arun,Stoukatch Serguei,Brebels Steven,Balachandran Jayaprakash,Beyne Eric,De Raedt Walter,Nauwelaers Bart,Poddar Anindya
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Co-Fabrication of Microcoaxial Interconnects and Substrate Junctions for Multichip Microelectronic Systems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-01
2. Wide-Band 6～10 GHz InGaAs 0.15 μm pHEMT 27
dBm Power Amplifier;The Journal of Korean Institute of Electromagnetic Engineering and
Science;2018-10
3. A Physics-Based Causal Bond-Wire Model for RF Applications;IEEE Transactions on Microwave Theory and Techniques;2012-12
4. Energy-Efficient Datacenters;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2012-10
5. Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-08