High-Speed Interconnects: History, Evolution, and the Road Ahead-Reference-Cited by-同舟云学术

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High-Speed Interconnects: History, Evolution, and the Road Ahead

Published:2022-08 Issue:8 Volume:23 Page:66-82
ISSN:1527-3342
Container-title:IEEE Microwave Magazine
language:
Short-container-title:IEEE Microwave

Author:

Kumbhare Vijay Rao¹,Kumar Rahul²,Majumder Manoj Kumar¹,Kumar Somesh³,Paltani Punya Prasanna¹,Kaushik Brajesh Kumar⁴,Sharma Rohit²

Affiliation:

1. Dr. S.P. Mukherjee International Institute of Information Technology, Naya Raipur, India

2. Indian Institute of Technology Ropar, , Rupnagar, India

3. ABV-Indian Institute of Information Technology and Management, Gwalior, India

4. Indian Institute of Technology, Roorkee, India

Funder

Indian Ministry of Electronics and Information Technology

Department of Science and Technology, Government of India

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx7/6668/9819810/09819842.pdf?arnumber=9819842

Reference53 articles.

1. Electrical Modeling of On-Chip Cu-Graphene Heterogeneous Interconnects

2. Thermal Properties of Graphene–Copper–Graphene Heterogeneous Films

3. Controlling the Diameter of Single-Walled Carbon Nanotubes by Improving the Dispersion of the Uniform Catalyst Nanoparticles on Substrate

4. Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

5. Electro-thermal RF modeling and performance analysis of graphene nanoribbon interconnects

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applying the high-k dielectric materials in vertical multilayer graphene nanoribbon (V-MLGNR) based interconnect for improving transmission performance;Micro and Nanostructures;2024-09

2. Energy‐Efficient Integrated Photonic Topological Devices;Laser & Photonics Reviews;2024-08-17

3. First Principle Analysis of Borophene as an On-Chip Interconnect Material;Nano;2024-06-26

4. High-frequency characteristics of multilayer graphene nanoribbon interconnects: Exploring the implications OF SKIN effect;Micro and Nanostructures;2024-05

5. Design of Patterned Transcendental Metamaterial Cover Structures for Crosstalk Reduction in FBAR Parallel Feed Lines;2024 Photonics & Electromagnetics Research Symposium (PIERS);2024-04-21

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