Thermal Modelling of Silicon Photonic Ring Modulator with Substrate Undercut
Author:
Affiliation:
1. Department Materials Engineering, KU Leuven, Leuven, Belgium
2. IMEC, Leuven, Belgium
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx7/50/9809956/09744450.pdf?arnumber=9744450
Reference23 articles.
1. Optimization of metallic microheaters for high-speed reconfigurable silicon photonics
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4. Resolving the thermal challenges for silicon microring resonator devices
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