3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform-Reference-Cited by-同舟云学术

3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform

Published:2023 Issue: Volume: Page:1-19
ISSN:1077-260X
Container-title:IEEE Journal of Selected Topics in Quantum Electronics
language:
Short-container-title:IEEE J. Select. Topics Quantum Electron.

Author:

Bian Yusheng¹^ORCID,Ramachandran Koushik¹,Wu Zhuo-Jie¹,Hedrick Brittany¹,Dezfulian Kevin K.¹,Houghton Thomas¹,Nummy Karen¹,Fisher Daniel¹,Hirokawa Takako¹^ORCID,Donegan Keith¹,Afzal Francis O¹,Esopi Monica¹,Karra Vaishnavi¹,Lee Won Suk¹,Sorbara Massimo¹,Lubguban Jorge¹,Cho Jae Kyu¹,Cao Rongtao¹,Ding Hanyi¹,Chandran Sujith¹,Rakowski Michal¹,Aboketaf Abdelsalam¹^ORCID,Krishnamurthy Subramanian¹,Mills Scott¹,Peng Bo¹,Pepper Jeff²,Deka Suruj²,Feng Wen²,Rishton Steven²,Boudreau Marcel²,Logan Dylan³,Hickey Ryan³,Gomes Prova Christina³,Murray Kyle⁴,Dewanjee Arnab³,Riggs Dave¹,Robson Norman¹,Melville Ian¹,Augur Rod¹,Fox Robert¹,Gupta Vikas¹,Yu Anthony¹,Giewont Ken¹^ORCID,Pellerin John¹,Letavic Ted¹

Affiliation:

1. GlobalFoundries, Malta, NY, USA

2. Lumentum Operations LLC, San Jose, CA, USA

3. Ranovus Inc, Kanata, ON, Canada

4. Ranovus GmbH, Nuremberg, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/2944/4481213/10021968.pdf?arnumber=10021968

Reference107 articles.