PIXAPP Photonics Packaging Pilot Line – Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity-Reference-Cited by-同舟云学术

PIXAPP Photonics Packaging Pilot Line – Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity

Published:2022-05 Issue:3 Volume:28 Page:1-11
ISSN:1077-260X
Container-title:IEEE Journal of Selected Topics in Quantum Electronics
language:
Short-container-title:IEEE J. Select. Topics Quantum Electron.

Author:

Bundalo Ivan-Lazar¹^ORCID,Morrissey Padraic E.¹,Annoni Andrea²,Baets Roel³^ORCID,Blache Fabrice⁴,Breyne Laurens³,Carrol Lee¹,Collins Sean¹,Dietrich Philipp-Immanuel⁵,Halmo Leos⁶,Jorge Filipe⁴^ORCID,Karppinen Mikko⁷,Kaunisto Mikko⁷,Kelly Brian⁸^ORCID,Van Kerrebrouck Joris³,Koos Christian⁹^ORCID,Lahti Markku⁷^ORCID,Lambrecht Joris³,Marcello Tienforti²,Lee Junsu Su¹,Missinne Jeroen³^ORCID,Ossieur Peter³,Pessina Roberto²,Sterken Tom³,Van Steenberge Geert³^ORCID,Vannucci Antonello²,Vannucchi Alessandro²,Verplancke Rik³^ORCID,Wuytens Pieter¹⁰^ORCID,Xu Yilin⁹^ORCID,Zoldak Martin⁶,OaBrien Peter¹

Affiliation:

1. Photonics Packaging and Integration Group at Tyndall National Institute, Cork, Ireland

2. Cordon Electronics Italy, Agrate Brianza, Italy

3. imec/Ghent University, Ghent, Belgium

4. III-V labs, Campus de Polytechnique 1, Palaiseau, France

5. KIT, Karlsruhe, Germany

6. Argotech a.s., Náchod, Czech Republic

7. VTT, Oulu, Finland

8. Eblana Photonics, West Pier Business Campus, Dublin, Ireland

9. Karlsruhe Institute of Technology (KIT), Institute of Photonics and Quantum Electronics, Karlsruhe, Germany

10. imec / Ghent University, Switzerland

Funder

H2020 Research Infrastructures

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/2944/9519571/09735288.pdf?arnumber=9735288

Reference19 articles.

1. Silicon photonics packaging with lateral fiber coupling to apodized grating coupler embedded circuit

2. Optical and Electronic Packaging Processes for Silicon Photonic Systems

3. Packaging Process for Grating-Coupled Silicon Photonic Waveguides Using Angle-Polished Fibers

4. Challenges and Opportunities in Future High-Capacity Optical Transmission Systems

5. Hybrid integration of laser source on silicon photonic integrated circuit for low-cost interferometry medical device

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