Packaging and Interconnect Considerations in Neuromorphic Photonic Accelerators-Reference-Cited by-同舟云学术

Packaging and Interconnect Considerations in Neuromorphic Photonic Accelerators

Published:2023-03 Issue:2: Optical Computing Volume:29 Page:1-11
ISSN:1077-260X
Container-title:IEEE Journal of Selected Topics in Quantum Electronics
language:
Short-container-title:IEEE J. Select. Topics Quantum Electron.

Author:

Nezami Mohammadreza Sanadgol¹^ORCID,de Lima Thomas Ferreira²,Mitchell Matthew¹,Yu Shangxuan¹,Wang Jing¹^ORCID,Bilodeau Simon²^ORCID,Zhang Weipeng²,Al-Qadasi Mohammed¹,Taghavi Iman¹,Tofini Alexander¹,Lin Stephen¹^ORCID,Shastri Bhavin J.³,Prucnal Paul R.²,Chrostowski Lukas¹^ORCID,Shekhar Sudip¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, BC, Canada

2. Department of Electrical Engineering, Princeton University, Princeton NJ, USA

3. Department of Physics, Engineering Physics & Astronomy, Queen's University, Kingston, ON, Canada

Funder

Natural Sciences and Engineering Research Council of Canada

SiEPICfab consortium

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/2944/9872324/09864251.pdf?arnumber=9864251

Reference65 articles.

1. High Efficiency, High Gain and High Saturation Output Power Quantum Dot SOAs Grown on Si and applications

2. In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

3. Photonic Integration With Epitaxial III–V on Silicon

4. Hybrid silicon evanescent laser fabricated with a silicon waveguide and III-V offset quantum wells

5. Overview and Future Challenges on III-V Integration Technologies in Silicon Photonics Platform

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