Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate-Reference-Cited by-同舟云学术

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Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

Published:2020-09 Issue: Volume: Page:
ISSN:
Container-title:2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
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Author:

Mehrotra Utkarsh,Cheng Tzu-Hsuan,Kanale Ajit,Agarwal Aditi,Han Kijeong,Baliga B. Jayant,Bhattacharya Subhashish,Hopkins Douglas C.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9163811/9170028/09170116.pdf?arnumber=9170116

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Overview of Finite-Element Analysis in Simulation of SiC Power Device Packaging;2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS);2021-12-06

2. Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for Solar PV Applications;2021 IEEE Energy Conversion Congress and Exposition (ECCE);2021-10-10

3. Optimized Kilowatt-Range Boost Converter Based on Impulse Rectification With 52 kW/l and 98.6% Efficiency;IEEE Transactions on Power Electronics;2021-07

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