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Comparison of System-Level ESD Design Methodologies—Towards the Efficient and ESD Robust Design of Systems

  • Published:2013-03 Issue:1 Volume:13 Page:213-222
  • ISSN:1530-4388
  • Container-title:IEEE Transactions on Device and Materials Reliability
  • language:
  • Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Scholz Mirko,Chen Shih-Hung,Vandersteen Gerd,Linten Dimitri,Hellings Geert,Sawada Masanori,Groeseneken Guido

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modular Measurement System for System-Efficient ESD Design on System and Component Level;IEEE Transactions on Electromagnetic Compatibility;2022-12

2. IC-based Antenna Switch Modeling and Robustness Evaluation for SEED Applications;2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium;2021-07-26

3. A Physics-based Transient Simulation and Modeling Method for Wide-frequency Electrical Overstress Including ESD;Applied Computational Electromagnetics Society;2021-06-14

4. Decreasing the Loading Effect of the TVS Diode Using a Transmission Line for RF and Microwave Applications;IEEE Letters on Electromagnetic Compatibility Practice and Applications;2021-03

5. System-Level Modeling for Transient Electrostatic Discharge Simulation;IEEE Transactions on Electromagnetic Compatibility;2015-12
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