Electroplating nanotwinned copper for ultrafine pitch redistribution layer (RDL) of advanced packaging technology
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9567715/9567716/09567993.pdf?arnumber=9567993
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of (111) oriented nanotwinned Cu substrate on the electromigration of Sn58Bi solder joint at high current density;Journal of Materials Science: Materials in Electronics;2024-07
2. The mechanical property and microstructural thermal stability of gradient-microstructured nanotwinned copper films electrodeposited on the highly (111)-orientated substrates;Materials Today Communications;2024-03
3. The influence of pattern size on the profile and microstructure of electroplated copper pad, redistribution layer and via for advanced packaging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
4. Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging;Materials;2023-06-26
5. The self-healing of Kirkendall voids on the interface between Sn and (1 1 1) oriented nanotwinned Cu under thermal aging;Applied Surface Science;2022-06
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