A new approach to using anisotropically conductive adhesives for flip-chip assembly-Reference-Cited by-同舟云学术

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A new approach to using anisotropically conductive adhesives for flip-chip assembly

Published:1996-03 Issue:1 Volume:19 Page:5-11
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Lyons A.M.,Hall E.,Yiu-Huen Wong ,Adams G.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/10404/00486555.pdf?arnumber=486555

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-07

2. Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA);Current Applied Physics;2013-07

3. Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-05

4. Chip warpage model for reliability prediction of delamination failures;Microelectronics Reliability;2012-04

5. A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry;IEEE Transactions on Components and Packaging Technologies;2010-03

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