The Environmental Footprint of IC Production: Meta-Analysis and Historical Trends

Author:

Pirson Thibault1,Delhaye Thibault1,Pip Alex2,Le Brun Gregoire1,Raskin Jean-Pierre1,Bol David1

Affiliation:

1. ICTEAM Institute

2. IMMC Institute, Université catholique de Louvain,Belgium

Publisher

IEEE

Reference14 articles.

1. DTCO including sustainability: Power-performance-area-cost-environmental score (PPACE) analysis for logic technologies;bardon;2020 IEEE International Electron Devices Meeting (IEDM),0

2. Moore's Law and ICT Innovation in the Anthropocene

3. Substituting computers for services-potential to reduce ICT's environmental footprint;plepys;Joint International Congress and Exhibition Electronics Goes Green 2000,2004

4. Rebound Effects and ICT: A Review of the Literature

5. Global warming of 1.5°C;masson-delmotte;IPCC Special Report,2018

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1. Methodical Challenges of Prognostic Lifecycle Assessment - an Exemplary Study of ICT's Environmental Impact in Germany 2030;2024 Electronics Goes Green 2024+ (EGG);2024-06-18

2. Comparative Life Cycle Analysis of Redistribution Layer for 3D Integrations;2024 Electronics Goes Green 2024+ (EGG);2024-06-18

3. Sustainable and Low-Power Logic Inverter-Based Batteryless SLIPT Receiver for IoT Nodes;2024 Joint European Conference on Networks and Communications & 6G Summit (EuCNC/6G Summit);2024-06-03

4. Sustainability Model for Semiconductor Manufacturing;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

5. Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device;Sustainability;2024-01-20

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