Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. An Introduction to Tape Automated Bonding Technology;Electronics Packaging Forum;1991
2. Overview of Tape Automated Bonding Technology;Circuit World;1990-01
3. Thermosonic Gold Wire Bonding to Copper Conductors;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1982-12
4. Face-Down TAB for Hybrids;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1980-12
5. Oxidation Kinetics of Cu Thin Films in Air at 100°C to 300°C;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1979-12