Stress and Fatigue Life Studies of Solder Joints in an Advanced Packaging with Chiplet
Author:
Affiliation:
1. Jilin University,College of Electronic Science and Engineering,Changchun,China,130012
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10256668/10256689/10256759.pdf?arnumber=10256759
Reference8 articles.
1. Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
2. Chiplets are the future of processors: Three advances boost performance, cut costs, and save power
3. Effects of anisotropy on the reliability of TSV microstructure
4. Effect of SiC nanoparticles on SAC305-TSV reliability under thermal load
5. Survey on Chiplet Packaging Structure and Communication Structure[J];guilin;Jisuanji Yanjiu yu Fazhan/Computer Research and Development,2022
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