Improving electromagnetic compatibility performance of packages and SiP modules using a conformal shielding solution
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5470270/5475475/05475724.pdf?arnumber=5475724
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-06
2. Complicated-trajectory Compartment EMI Shielding in SiP Modules by Dispensing Technology;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Effective low‐frequency EMI conformal shielding for system‐in‐package (SiP) modules;Microwave and Optical Technology Letters;2023-02-27
4. A novel integrated module cover using miniaturized slot antenna with electromagnetic shielding characteristics for packaging application;2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2022-11-27
5. Effective Conformal EMI Shielding Coating for SiP modules with Multi-shaped Nano-Ag Fillers;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
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