Design and Numerical Simulation of Vibration Isolation and Shock Resistance for the Electronic Equipment on the Rockets-Reference-Cited by-同舟云学术

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Design and Numerical Simulation of Vibration Isolation and Shock Resistance for the Electronic Equipment on the Rockets

Published:2022-11-18 Issue: Volume: Page:
ISSN:
Container-title:2022 5th World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM)
language:
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Author:

Lu Jianzhao¹

Affiliation:

1. The 10th Research Institute China Electronics Technology Group Corporation,Chengdu,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10021331/10021332/10021443.pdf?arnumber=10021443

Reference10 articles.

1. Application and verification of rubber absorber in spacecrafts;zhang;Spacecraft Environment Engineering,2017

2. Visco-elastic behavior through fractional calculus: An easier method for best fitting experimental results

3. Novel numerical and experimental analysis of dynamic responses under board level drop test;tee;Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems,0

4. The Modal analysis of the electronic equipment cabinet structure;liu;2007 Chinese Control Conference,0

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress–Strength Interference Modeling;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

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