16-element Conformal Sub-array Assembly and Its Impact on Performance
Author:
Affiliation:
1. Shanghai Aerospace Electronics Technology Research Institue,Micro-electronics business department,Shanghai,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9971151/9971154/09971237.pdf?arnumber=9971237
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3. LCP substrate based crescent shaped microstrip patch array antenna design for 5G applications;kutay;2019 3rd International Symposium on Multidisciplinary Studies and Innovative Technologies (ISMSIT),0
4. 95-GHz Front-End Receiving Multichip Module on Multilayer LCP Substrate for Passive Millimeter-Wave Imaging
5. Inkjet-printed, vertically-integrated, high-performance inductors and transformers on flexible LCP substrate
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