Author:
Dai Shanshan,Perera Rukshan T.,Yang Zi,Rosenstein Jacob K.
Funder
Research agreement from Hoffmann-LaRoche
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Biomedical Engineering
Cited by
29 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献