Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects
Author:
Affiliation:
1. University of South-Eastern Norway,Department of Microsystems,Horten,Norway
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939469.pdf?arnumber=9939469
Reference16 articles.
1. Oriented Assembly of Gold Nanorods on the Single-Particle Level
2. Transfer printing of sub-100nm nanoparticles by soft lithography with solvent mediation
3. Anisotropic conductive film interconnects for fine-pitch MEMS
4. Electromechanical characterization of individual micron-sized metal coated polymer particles
5. Electrophoretic Deposition of Ni/Au Coated Particles for Ultra-Fine Pitch Interconnection
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Enabling Low Pressure, Low Temperature, and Particle Control for Anisotropic Conductive Adhesives;Advanced Materials Technologies;2024-05-07
2. Flip-Chip Interconnects Based on Single Metal-Coated Polymer Spheres;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
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