Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering-Reference-Cited by-同舟云学术

Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

Published:2022-09-13 Issue: Volume: Page:
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Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Ji Xinrui¹,Van Zeijl Henk¹,Romijn Joost¹,Van Ginkel Hendrik Joost¹,Liu Xu¹,Zhang Guoqi¹

Affiliation:

1. Delft University of Technology,Electronic Components, Technology and Materials,Delft,The Netherland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939417.pdf?arnumber=9939417

Reference9 articles.

1. 3D interconnect technology based on low temperature copper nanoparticle sintering

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3. Low-loss additively-deposited ultra-short copper-paste interconnections in 3d antenna-integrated packages for 5g 371 and iot applications;watanabe;2019 IEEE 69th Electronic Components and Technology Conference (ECTC),0

4. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

5. Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology

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