Development and characterization of a monolithic ceramic pre-package for SiC-semiconductor devices based on LTCC technology-Reference-Cited by-同舟云学术

Development and characterization of a monolithic ceramic pre-package for SiC-semiconductor devices based on LTCC technology

Published:2022-09-13 Issue: Volume: Page:
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Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Lenz Christian¹,Ziesche Steffen¹,Reinhardt Kathrin¹,Korner Stefan¹,Schletz Andreas²,Bach Hoang Linh²,Schmidt Ingo³,Simon-Naiasek Michel⁴

Affiliation:

1. Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany

2. Fraunhofer Institute for Integrated Systems and Device Technology IISB,Erlangen,Germany

3. Fraunhofer Institute for Mechanics of Materials IWM,Freiburg,Germany

4. Fraunhofer Institute for Micorstructure of Materials and Systems IMWS,Halle,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939430.pdf?arnumber=9939430

Reference11 articles.

1. A comprehensive Overview on Today's Ceramic Substrate Technologies;bechtold;European Microelectronics & Packaging Conference,2009

2. LTCC Embedding of SiC Power Devices for High Temperature Application sover 400 °C;bayer;Electronics System Integration Technology Conference (ESTC),0

3. Improved Co-Firing of Ferrite and Dielectric Tape Based on Master Sintering Curve Predictions and Shrinkage Mismatch Calculations

4. Zero Shrinkage of LTCC by Self-Constrained Sintering

5. Real embedding process of SiC devices in a monolithic ceramic package using LTCC technology

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