Bringing Nanotechnology Closer to Electrical Engineers: Training Course Development for Upskilling in the METIS Project-Reference-Cited by-同舟云学术

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Bringing Nanotechnology Closer to Electrical Engineers: Training Course Development for Upskilling in the METIS Project

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
language:
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Author:

Bonyar Attila¹,Zangana Shereen¹,Tzanova Slavka²,Afsar Maria³

Affiliation:

1. Budapest University of Technology and Economics,Faculty of Electrical Engineering and Informatics,Department of Electronics Technology,Budapest,Hungary

2. Technical University of Sofia,Department of Microelectronics,Sofia,Bulgaria

3. SEMI Europe,Brussels,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939533.pdf?arnumber=9939533

Reference12 articles.

1. Guest Editorial: Nanopackaging Part I

2. Selected Nanotechnology Advances in Interconnections, Power, RF and Sensor Integration - A View from ECTC 2022;huang;IEEE EPS e-Newsletter,2022

3. Next-Generation Nanopackaging [Guest Editorial]

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