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Ceramic Pin Grid Array with Built-in Interconnects to Locate TSV Integrated Ion Trap for Wire Bonding-free Assembly

  • Published:2022-09-13 Issue: Volume: Page:
  • ISSN:
  • Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
  • language:
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Author:

Zhao Peng1,Li Hong Yu2,Lim Yu Dian1,Hu Liang Xing1,Seit Wen Wei2,Guidoni Luca3,Tan Chuan Seng1

Affiliation:

1. School of Elecical and Electronic Engineering, Nanyang Technological University,Singapore

2. Institute of Microelectronics Agency for Science, Technology and Research (A*STAR),Singapore

3. Laboratoire Matérianx et Phénomènes Quantiques, Université de Paris,Paris,France

Funder

National Research Foundation

Publisher

IEEE

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in Ambient;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Time Evolution Study of Two-Step Plasma-Treated Copper-Copper Direct Bonding in Ambient;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
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