Effects of detailed substrate modeling and solder layout design on the 1<sup>st</sup> and 2<sup>nd</sup> level solder joint reliability for the large die FCBGA-Reference-Cited by-同舟云学术

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Effects of detailed substrate modeling and solder layout design on the 1^st and 2^nd level solder joint reliability for the large die FCBGA

Published:2008-04 Issue: Volume: Page:
ISSN:
Container-title:EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
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Author:

Biswas Kalyan,Shiguo Liu ,Xiaowu Zhang ,Chai T. C.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4515856/4525005/04525051.pdf?arnumber=4525051

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1. Significance of Die Shadow Size and Placement on Solder Joint Reliability Performance;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

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