Thermal Conductivity Measurements of Thermal Interface Materials Using the Bidirectional 3-Omega Method-Reference-Cited by-同舟云学术

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Thermal Conductivity Measurements of Thermal Interface Materials Using the Bidirectional 3-Omega Method

Published:2022-09-28 Issue: Volume: Page:
ISSN:
Container-title:2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Grosse-Kockert Corinna¹^ORCID,Ras Mohamad Abo¹,May Daniel²,Cremieux-Trives Alexandre³,Loffler Florian¹,Wunderle Bernhard⁴

Affiliation:

1. Berliner Nanotest und Design GmbH,Berlin,Germany

2. Technische Universität Chemnitz,Berliner Nanotest und Design GmbH,Berlin,Germany

3. Berliner Nanotest und Design GmbH Toulouse, INP ENSIACET,Berlin,Germany

4. Technische Universität Chemnitz,Chemnitz,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9950458/9950600/09950693.pdf?arnumber=9950693

Reference14 articles.

1. Chapter 2: Measuring the thermal conductivity of thin films: 3-omega and related electrothermal methods;dames;Ann Rev Heat Trans,2013

2. General bidirectional thermal characterization via the 3ω technique

3. Data reduction in 3ω method for thin-film thermal conductivity determination

4. 1ω,2ω, and 3ω methods for measurements of thermal properties

5. Thermal conductivity measurements using 1ω and 3ω methods revisited for voltage-driven setups

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