Thermal modelling of embedded microscale channel structures realized in heterogeneous packaging-Reference-Cited by-同舟云学术

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Thermal modelling of embedded microscale channel structures realized in heterogeneous packaging

Published:2022-09-28 Issue: Volume: Page:
ISSN:
Container-title:2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Bognar Gyorgy¹,Takacs Gabor¹,Szabo Peter G.¹

Affiliation:

1. Budapest University of Technology and Economics,Department of Electron Devices,Budapest,Hungary

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9950458/9950600/09950627.pdf?arnumber=9950627

Reference14 articles.

1. Thermal modelling of integrated microscale heatsink structures

2. JEDEC Standard N°51-7;High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages,0

3. Intel's High Performance Graphics solutions in thin and light mobile form factors;chennupaty;Hot Chips 8 A Symp on High-Performance Chips,2018

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