Author:
Grun Tobias,May Daniel,Straub Hubert,Jakub Gromala Przemyslaw,Wunderle Bernhard
Cited by
2 articles.
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1. Validation of the thermal path with one phase liquid cooling for HPC in harsh environment;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Liquid cooling solutions for Automotive HPC: Thermal path characterisation;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25