Observer based junction temperature estimation : 3D simulations and experimentations-Reference-Cited by-同舟云学术

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Observer based junction temperature estimation : 3D simulations and experimentations

Published:2023-09-27 Issue: Volume: Page:
ISSN:
Container-title:2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Kabwangala Tychique Nzalalemba¹,Fradin Jean-Pierre²,Ariba Yassine³,Marie Alexandre²,Gouaisbaut Frédéric⁴

Affiliation:

1. Université Loyola du Congo,LAAS-CNRS, Faculté D’ingénierie ULC-Icam,Kinshasa,D.R. Congo

2. Toulouse Campus,Icam School of Engineering,Toulouse,France

3. Université de Toulouse,LAAS-CNRS, INSA Toulouse,Toulouse,France

4. Université de Toulouse,LAAS-CNRS, Université Paul Sabatier,Toulouse,France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10325669/10325677/10325885.pdf?arnumber=10325885

Reference26 articles.

1. Extraction of compact transient thermal models for a global optimization of a power system based on SiC MOSFETs switches;cassou;19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),2020

2. Thermal parameter estimation using recursive identification

3. Thermal-Feature System Identification for a Machine Tool Spindle

4. Development of a predictive observer thermal model for power semiconductor devices for overload monitoring in high power high frequency converters

5. Choosing a thermal model for electrothermal simulation of power semiconductor devices

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