An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules-Reference-Cited by-同舟云学术

An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules

Published:2023-09-27 Issue: Volume: Page:
ISSN:
Container-title:2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Al-Hinaai Amin¹,Huesgen Till¹,Buttay Cyril²,Vagnon Eric²,Ettinger Ildiko³,Asllani Besar⁴,Combettes Céline⁵

Affiliation:

1. University of Applied Sciences,Electronics Integration Laboratory,Kempten,Germany

2. Université Claude Bernard Lyon 1 Ecole Centrale de Lyon, Ampère,Univ Lyon, CNRS, INSA Lyon,Villeurbanne,France,UMR5005

3. CeramTec GmbH,Plochingen,Germany,73207

4. SuperGrid Institute,Villeurbanne Cedex,France,69628

5. UMR 5213 - CNRS - Toulouse INP - UT3,Laboratoire plasma et conversion d’énergie,Paul Sabatier,France

Funder

Bundesministerium für Bildung und Forschung

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10325669/10325677/10325867.pdf?arnumber=10325867

Reference8 articles.

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2. Pulse Proof, High Power Thick Film Chip Resistors;Pulsed Power Conference (PPC) 2015 20th IEEE,0

3. Thermal Management Optimization of a 5 MW Power Electronic Converter;reynes;Europ Advanced Technology Work on Micropackaging and Thermal Management,2017

4. Design of a SiC based triple active bridge cell for a multi-megawatt DC-DC converter;maneiro;2017 19th European Conference on Power Electronics and Applications (EPE’17 ECCE Europe),2017

5. Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches;de vienne;PCIM Europe 2023 International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management,2023