1. Effect of Grain Boundaries on the Electrical Property of Copper Wires;wen;Transactions of Nonferrous Metals Society of China,0
2. Moisture induced corrosion in gold and copper ball bonds
3. Copper versus palladium coated copper wire process and reliability differences
4. Oxidation and Corrosion of Au/AI and Cu/AI in Wire bonding Assembly;lee;13th International Conference on Electronic Packaging,0
5. A Review of Palladium Coated Copper Wire Bonding for Automotive Device;lau;International Journal of Mechanical and Production Engineering Research and Development (IJMPERD),2020