Failure Analysis of RF VGA in Base Station System and GaAs HBT Process Improvement-Reference-Cited by-同舟云学术

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Failure Analysis of RF VGA in Base Station System and GaAs HBT Process Improvement

Published:2023-07-24 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Author:

Shi Lin¹,Wang Chong¹,Cai Xiaolong²,Cao Zhengya²,Zheng Xuefeng¹,Gao Shang³

Affiliation:

1. Xidian University,Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices,Xi’an,China

2. Zhongxing Xili Industrial Park,State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,China

3. Zhongxing Xili Industrial Park,Component Engineering Dept.,Shenzhen,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10248978/10248979/10249198.pdf?arnumber=10249198

Reference8 articles.

1. GaAs RF Amplifier Field Failure Analysis and Reliability Prediction in 5G AAU System

2. Etching of 200 ϋm deep GaAs via holes with near vertical wall profile using photoresist mask with inductively coupled plasma

3. A Linear InGaP/GaAs HBT Power Amplifier Using Parallel-Combined Transistors With IMD3 Cancellation

4. A high-linearity InGaP/GaAs HBT power amplifier for IEEE 802.11a/n;lei;Journal of Semiconductors,2013

5. Failure Analysis of damaged dielectric on resistor and capacitor with EMMI and IR-OBIRCH

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