PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions
Author:
Affiliation:
1. LinkE Technologies (HengQin),Zhuhai,China
2. Southwest University of Science and Technology,Mianyang,China
3. Intel Corporation,Oregon,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9888259/9888262/09888294.pdf?arnumber=9888294
Reference23 articles.
1. A Novel Method for Measuring Permittivity Using Transmission Line Analysis at Microwave Frequencies
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3. Characterization of PCB dielectric properties using two striplines on the same board;lei;2014 Int Symp on Electromag Compat,2014
4. Delta-L methodology for efficient PCB trace loss characterization
5. Broadband Dielectric Measurement of PCB and Substrate Materials by Means of a Microstrip Line of Adjustable Width
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