Thermal Design of SiC Power Module for EV/HEV Applications-Reference-Cited by-同舟云学术

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Thermal Design of SiC Power Module for EV/HEV Applications

Published:2022-10-26 Issue: Volume: Page:
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Container-title:2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Liu Chun-Kai¹,Po-Kai Chiu¹,Huang Yuan-Cheng¹,Syu Ji-Yuan¹,Chen Yao-Shun¹,Chou Yu-An²,Wu Kuang-Hung²,Pan Wen-Yang²

Affiliation:

1. Electronic and Optoelectronics Research Laboratories Industrial Technology Research Institute No.195, Sec4, Chung Hsing Rd.,Chutung,Hsinchu,Taiwan,31057

2. Flotrend Corporation 13F., No.550, Sec5, Zhongxiao E. Rd., Xinyi Dist.,Taipei City 110,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9966654/9966628/09966722.pdf?arnumber=9966722

Reference10 articles.

1. Traction Power Inverter Design for EV and HEV Applications at General Motors: A Review

2. Direct liquid cooling For IGBT power module

3. IGBT power module packaging for EV applications;liu;International Conference on Electronic Materials and Packaging (EMAP),2012

4. Enabling Technologies for Compact Integrated Electric Drives for Automotive Traction Applications

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Design of Direct Cooling Power Module for EV Applications;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

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