Avalanche Photodiode with Multiple Multiplication-Layers and Flip-Chip Bonding Package for 4-D FMCW LiDAR Applications
Author:
Affiliation:
1. National Central University,Department of Electrical Engineering,Jhongli,Taiwan,320
2. National Sun Yat-Sen University,Department of Photonics,Kaohsiung,Taiwan
3. National Yang-Ming Chiao-Tung University,Department of Photonics,Hsinchu,Taiwan,300
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10360489/10360472/10360573.pdf?arnumber=10360573
Reference4 articles.
1. Responsivity-Bandwidth Limit of Avalanche Photodiodes: Toward Future Ethernet Systems
2. Avalanche photodiodes with multiple multiplication layers for coherent detection
3. Enhanced Velocity Sensitivity in 4-D FMCW LiDAR by Use of Avalanche Photodiode with Cascaded Multiplication Layer
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