Silicon Based System-in-Package : a new technology platform supported by very high quality passives and system level design tools-Reference-Cited by-同舟云学术

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Silicon Based System-in-Package : a new technology platform supported by very high quality passives and system level design tools

Published:2007-01 Issue: Volume: Page:
ISSN:
Container-title:2007 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
language:
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Author:

Murray F.,LeCornec F.,Bardy S.,Bunel C.,Verhoeven Jan F.c.,van den Heuvel F.C.M.,Klootwijk J.H.,Roozeboom F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4117300/4117301/04117348.pdf?arnumber=4117348

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Overcoming Silicon Limitations in Nanophotonic Devices by Geometrical Innovation: Review;IEEE Photonics Journal;2023-08

2. Multi-terminal Ultra-thin 3D Nanoporous Silicon Capacitor Technology for High-Speed Circuits Decoupling;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Mechanical Robustness Study of Ultra Low Profile 3D Silicon Capacitors;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

4. Integrated 3D-Capacitors for Implantable Bradycardia Pacemakers: Dielectric Integrity and Local Electrical Characterizations using AFM;Proceedings of the 14th International Joint Conference on Biomedical Engineering Systems and Technologies;2021

5. High-Density Capacitor Devices Based on Macroporous Silicon and Metal Electroplating;IEEE Transactions on Electron Devices;2014-01

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