Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Optimum pressure in low temperature direct metal bonding;2010 12th Electronics Packaging Technology Conference;2010-12
2. Strength and reliability of ceramic modules soldered to flexible cables;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1990
3. Solder Attachment of Leaded Components to Thick Film Hybrids;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1981-12
4. Degradation of Thermocompression Bonds to Ti-Cu-Au and Ti-Cu Thin Films by Thermal Aging;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1980-03
5. Oxidation Kinetics of Cu Thin Films in Air at 100°C to 300°C;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1979-12