A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A noble VFO(Vertical wire Fan Out) technology for small form factor and high performance memory applications

Published:2023-03-07 Issue: Volume: Page:
ISSN:
Container-title:2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
language:
Short-container-title:

Author:

Sung Ki-Jun¹,Eun Kyoungtae¹,Lee Seowon¹,Yoon Sungwon¹,Son Ho-Young¹,Lee Kang-Wook¹

Affiliation:

1. Integrated Interconnect & Packaging development, PKG Development Division,Sk Hynix,Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10102927/10102928/10102966.pdf?arnumber=10102966

Reference7 articles.

1. Evaluation of chip stackable FOWLP technology for high performance and large memory capacity;kim;Proceedings in Korean Microelectronics and Packaging Society,2020

2. Ultra-thin FO Package-on-Package for Mobile Application;yao;Proceedings of the Electronic Components Conference,2019

3. Study of Advanced Fan-Out Packages for Mobile Applications;hwang;Proceedings of the Electronic Components Conference,2016

4. 3D-MiM (MUST-in-MUST) Technology for Advanced System Integration

5. Fan-out Wafer Level Package for Memory Applications

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP