Author:
Wang Zhengyu,Keeble Lewis,Moser Nicolas,Lande Tor Sverre,Georgiou Pantelis
Cited by
3 articles.
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1. Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects;2023 IEEE Biomedical Circuits and Systems Conference (BioCAS);2023-10-19
2. A Low Power Differential ISFET-pH Lab-On-Chip for Remote Cell Monitoring;2023 IEEE 16th Dallas Circuits and Systems Conference (DCAS);2023-04-14
3. Towards a Wireless pH-Impedance Sensor System for IoT Applications;2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS);2022-08-07