Funder
Semiconductor Research Corporation
Air Force Office of Scientific Research
National Science Foundation
C-FAR/SONIC
Microelectronics Advanced Research Corporation
Defense Advanced Research Projects Agency
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A 3-D Reconfigurable Memory I/O Interface Using a Quad-Band Interconnect;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05