Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging-Reference-Cited by-同舟云学术

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Interfacial Characteristics and Dynamic Process of Au- and Cu-Wire Bonding and Overhang Bonding in Microelectronics Packaging

Published:2013-06 Issue:3 Volume:22 Page:560-568
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Li Junhui,Zhang Xiaolong,Liu Linggang,Han Lei

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx5/84/6521375/06384635.pdf?arnumber=6384635

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Design and experiment of a new double needle type piezoelectric jetting dispenser;Smart Materials and Structures;2023-02-09

3. Challenges & Solutions of Cu Wire Bonding on DFN Package with Low Modulus LeadFrame Tape;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. Die attachment, wire bonding, and encapsulation process in LED packaging: A review;Sensors and Actuators A: Physical;2021-10

5. Synthesis and characterization of Ag nanoflowers with different morphologies;IOP Conference Series: Materials Science and Engineering;2021-01-01

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