A High-Performance Dual-Cantilever High-Shock Accelerometer Single-Sided Micromachined in (111) Silicon Wafers
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
http://xplorestaging.ieee.org/ielx5/84/5638586/05595480.pdf?arnumber=5595480
Cited by 31 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Front-Side Fabricated Monolithic 5000g-/100000g-Measured Range Composite Shock Accelerometers with Small Chip-Size, High Resonant Frequency and Ultra-High Anti-overload Capacity;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21
2. Ultra-small high‐temperature pressure sensor chips fabricated in single‐layer (111) SOI wafers;Journal of Micromechanics and Microengineering;2023-06-21
3. Microleverage Mechanism Assisted Novel Biaxial Piezoresistive Micro Accelerometer With Improved Sensitivity;IEEE Sensors Journal;2023-05-01
4. A Single-Side Micromachined MPa-Scale High-Temperature Pressure Sensor;Micromachines;2023-04-29
5. Modeling and Characterization of a Novel In-Plane Dual-Axis MEMS Accelerometer Based on Self-Support Piezoresistive Beam;Journal of Microelectromechanical Systems;2022-12
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