Thermomechanical reliability of underfilled BGA packages-Reference-Cited by-同舟云学术

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Thermomechanical reliability of underfilled BGA packages

Published:2002-04 Issue:2 Volume:25 Page:100-106
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Pyland J.,Pucha R.V.,Sitararnan S.K.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/21979/01021634.pdf?arnumber=1021634

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies;Journal of Electronic Packaging;2012-03-01

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