Characteristics of RIE SF6/O2/Ar Plasmas on n-Silicon Etching
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4266544/4266545/04266741.pdf?arnumber=4266741
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of Various Wafer Surface Etching Processes on c-Si Solar Cell Characteristics;Energies;2021-07-07
2. Silicon nitride etch characteristics in SF6/O2 and C3F6O/O2 plasmas and evaluation of their global warming effects;Microelectronics Reliability;2012-12
3. Demonstration of 3C-SiC MEMS Structures on Polysilicon-on-oxide Substrates;MRS Proceedings;2010
4. Growth of cubic silicon carbide on oxide using polysilicon as a seed layer for micro-electro-mechanical machine applications;Journal of Crystal Growth;2009-08
5. Growth of Single Crystal 3C-SiC(111) on a Poly-Si Seed Layer;Materials Science Forum;2009-03
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