Author:
Lovberg Andreas,Tegehall Per-Erik
Cited by
2 articles.
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1. Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. Effect of Rapid Thermal Fatigue on Microstructure and Properties of Sn3.0Ag0.5Cu/Cu Solder Bumps;2020 21st International Conference on Electronic Packaging Technology (ICEPT);2020-08