Performance Assessment of different Machine Learning Algorithm for Life-Time Prediction of Solder Joints based on Synthetic Data

Author:

Muench S.1,Bhat D.1,Heindel L.2,Hantschke P.2,Roellig M.1,Kaestner M.2

Affiliation:

1. Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany,01109

2. Technische Universität Dresden,Institute of Solid Mechanics,Dresden,Germany,01062

Funder

European Regional Development Fund

Publisher

IEEE

Reference21 articles.

1. Model for BGA and CSP reliability in automotive underhood applications;lall;IEEE Components and Packaging Technologies,2004

2. Keras;chollet,2015

3. TensorFlow Developers,2021

4. Deep learning;goodfellow,2016

5. Deep learning;lecun;Nature,2015

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1. Application oriented On-The-Edge Capable Prognostic and Health Monitoring Framework for Solder Joints in Electronics;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Virtual qualification using digital twin for product development: A case study on liquid crystal display;Quality and Reliability Engineering International;2023-10-22

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4. Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11

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