Author:
Schwerz R.,Roellig M.,Wolter K.-J.
Cited by
6 articles.
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1. Non-linear viscoelastic Material Models of Polymers for Electronics Simulation - Measurement, Modelling, Validation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Application oriented On-The-Edge Capable Prognostic and Health Monitoring Framework for Solder Joints in Electronics;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11
4. Performance Assessment of different Machine Learning Algorithm for Life-Time Prediction of Solder Joints based on Synthetic Data;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
5. Macro- and Microscopic DMA measurements - Complementary techniques to determine viscoelastic material properties of packaging polymers;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25