Optical and thermal simulation chain for LED package-Reference-Cited by-同舟云学术

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Optical and thermal simulation chain for LED package

Published:2016-04 Issue: Volume: Page:
ISSN:
Container-title:2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
language:
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Author:

Tapaninen Olli,Myohanen Petri,Majanen Mikko,Sitomaniemi Aila,Olkkonen Juuso,Hildenbrand Volker,Gielen Alexander W. J.,Mackenzie Fidel Valega,Barink Marco,Smilauer Vit,Patzak Borek

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7459073/7463292/07463349.pdf?arnumber=7463349

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on Optical and Thermal Uniformity of LED Filament Based on Flip Chip1;Journal of Electronics and Sensors;2020-12-28

2. Model for estimating power dissipation along the interconnect length in single on-chip topology;Evolutionary Intelligence;2020-05-02

3. Health Monitoring for Lighting Applications;Sensor Systems Simulations;2019-06-19

4. Improving the Optical Properties of the 8500 K In-cup Packaging WLEDs by Using the Green-emitting CaF 2 :Ce 3+ , Tb 3+ Phosphor;Lecture Notes in Electrical Engineering;2017-11-11

5. Quality and Reliability in Solid-State Lighting: Qua Vadis?;Solid State Lighting Reliability Part 2;2017-07-13

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