Parameter identification for interface delamination processes in molded electronic packages-Reference-Cited by-同舟云学术

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Parameter identification for interface delamination processes in molded electronic packages

Published:2016-04 Issue: Volume: Page:
ISSN:
Container-title:2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Schlegel Roger,Muller Axel,Niemeier Roland,Gromala Przemyslaw Jakub

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7459073/7463292/07463399.pdf?arnumber=7463399

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Robust Design Optimization for Failure Analysis;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

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