Author:
Liu Chao-Wei,Wu Shang-Lin,Chen Ming-Hung,Yeh Chang-Lin,Pi Tun-Ching,Kao Jen-Chieh
Cited by
1 articles.
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1. Ultra-thin Double Side SiP Technology with Embedded Trace Substrate;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28