An AI Predicted Capacitance-Based Electromagnetic Analysis Method about Metal Fill Effect for 5G/B5G Applications-Reference-Cited by-同舟云学术

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An AI Predicted Capacitance-Based Electromagnetic Analysis Method about Metal Fill Effect for 5G/B5G Applications

Published:2022-11-27 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
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Author:

Tang Yijie¹,Li Xiangliang¹,Zhao Peng¹

Affiliation:

1. Hangzhou Dianzi University,College of Electronic Information

Funder

National Natural Science Foundation of China

Research and Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10106786/10106791/10106837.pdf?arnumber=10106837

Reference6 articles.

1. Design considerations for 60 GHz CMOS radios

2. Patterned Floating Dummy Fill for On-Chip Spiral Inductor Considering the Effect of Dummy Fill

3. Effective Permittivity of 3-D Periodic Composites With Regular and Irregular Inclusions

4. Design of Millimeter-Wave CMOS Radios: A Tutorial

5. A Scalable Model of On-Chip Inductor Including Tunable Dummy Metal Density Factor

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